CICC

CICC Student Travel Grant Awards

CICC 2019 Student Travel Grant Awards Program recognizes and promotes early career accomplishments in all solid-state circuits fields by supporting graduate student travel to attend CICC 2019 in Austin, Texas, USA.

With the help of the CICC STGA program, up-and-coming young engineers:

  • May network with researchers from the industry, academia, and government from all over the world
  • Learn about IC design break-throughs, and about challenges that have not yet been solved or need to be addressed, in-person and in advance.

Travel stipends up to US$400 per student will be awarded.

Priority will be given to 1st/2nd year PhD students worldwide who will NOT be an author or co-author for any papers at CICC 2019.

Requirements for CICC 2019 Student Travel Grant Awards Program:

  • Applicants must be an IEEE SSCS Student Member
  • Applicants must submit a personal statement (less than 300 words) to state their research interests and their relevance to the technical focuses of CICC
  • Applicants must submit a CV. The applicant’s IEEE membership number and contact information should be included on the first page of the CV
  • Applicant’s supervisor must submit a signed recommendation letter with university letterhead. The recommendation letter should certify that the applicant (1) is an IEEE SSCS Student Member, (2) is in the 1st/2nd year PhD study (if applicable),  and (3) will NOT be an author or co-author for any paper at CICC 2019 (if applicable)
  • Student awardees are expected to volunteer (1 day) helping the CICC 2019 team. The volunteer tasks will be assigned after the awardees are selected
  • Student awardees are expected to be present at the 2019 CICC conference from Monday (April 15th) until Wednesday afternoon (April 17th) including the CICC closing/award ceremony
  • The application may only be submitted by the supervisor as a single PDF file
  • Each supervisor/research group may recommend up to 3 graduate students
  • Past CICC PhD student sponsorship initiative awardees are not eligible.
  • Applications will be evaluated based on the personal statement, CV, and supervisor’s recommendation letter. The committee will start to select student awardees until the funding runs out or the application deadline is reached (whichever occurs first). Early submissions will have higher priority and is strongly encouraged.

Important Dates:
The application deadline is 20 March 2019 (mid-night US PST).

Additional Notes:
The IEEE CICC TPC committee reserves the right to verify details of the applications against IEEE records and other resources.

Contact Information:
For questions about the CICC Student Travel Grant Awards, please contact Julian Tham (jtham@ieee.org).

Submission:
The student’s supervisor should email the application package (as one single PDF file for each student) directly to:

John Teehan, CMP (j.teehan@ieee.org) and Julian Tham (jtham@ieee.org).

Each student application should include:
(1) a personal statement (less than 300 words) from the student
(2) student CV, and
(3) a signed recommendation letter with university letterhead from the supervisor.

The travel awards will be a check mailed to the student awardee.

The travel awards will only be honored to the student awardees who have completed the full conference registration and attended the CICC 2019 conference. In order to qualify for the travel award, the student awardee need to check-in with John Teehan or Tracy Holle and show a valid ID (passport, driver license, etc.) at the CICC 2019 conference registration desk.