Call for Papers Overview
IEEE CICC Call for Papers
Paper Submission Deadline has been extended to
November 15, 2018, 11:59 pm Pacific Time
Contact the Conference Manager, Melissa Widerkehr (firstname.lastname@example.org), with questions.
is sponsored by the IEEE Solid-State Circuits Society
and technically co-sponsored by the IEEE Electron Devices Society
April 14 – April 17, 2019
The IEEE CICC Custom Integrated Circuits Conference is a premier conference devoted to IC development. CICC is the conference to find out how to solve design problems, improve circuit design techniques, get exposure to new technology areas, and network with peers, authors and industry experts.
The CICC technical program includes • Power Management • Analog Circuits and Techniques • Data Converters • Wireless Transceivers and RF/mm Wave Circuits • Wireline and Optical Communications Circuits and Systems • Design Foundations • Emerging Technologies
CICC bestows awards for Best Invited Paper, Best Regular Paper and Best Student Paper
Follow the sidebar links for further information about the topics of interest and abstract submission process.
Conference Technical Sessions and Events
Technical Sessions addressing a broad range of circuits, applications, design techniques, tools, test, reliability, and emerging technologies, and providing education on new, state-of-the-art developments is the core of the CICC technical program.
Educational Sessions instructed by recognized invited speakers who are among the best in the industry are included in the conference. They are valuable opportunities to refresh key skills in traditional circuit-design methods and acquire knowledge in vital new areas in analog, digital, and RF integrated circuit design.
Panels, Forums and a Plenary Session provide a platform for leaders from the IC industry and academia to present highlights on new field of research and development related to circuit design and to debate key issues and controversial topics. CICC panels are well known for their lively and thought-provoking discussion and audience participation.
Our Exhibit, is where semiconductor manufacturers, IP providers, SW tool suppliers, design-service houses, and technical book publishers offer of their products. Our Welcome Reception, Conference Luncheon and Exhibit with food and beverage, provide additional opportunities for discussion and peer networking.
Alessandro Piovaccari, Silicon Laboratories: email@example.com
Hua Wang, Georgia Institute of Technology: firstname.lastname@example.org
Technical Program Chair
Fa Foster Dai: mailto:email@example.com